Fully-buffered dual in-line memory module with fault correction

ABSTRACT

A memory module comprises first memory that stores data in memory blocks; second memory that temporarily stores data from at least one of the memory blocks and third memory for storing a relationship between addresses of the at least one of the memory blocks in the first memory and corresponding addresses of the data from the at least one of the memory blocks in the second memory. Storage capacities of the second and third memories are less than a storage capacity of the first memory. A control module selectively transfers data in the at least one of the memory blocks in the first memory to the second memory and stores and retrieves data from the second memory for the at least one of the memory blocks based on the relationship during the testing.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. ProvisionalApplication Nos. 60/827,976, filed on Oct. 3, 2006, 60/825,361, filed onSep. 12, 2006, 60/823,989, filed on Aug. 30, 2006 and 60/821,422, filedon Aug. 4, 2006 and is a continuation in part of U.S. patent applicationSer. No. 11/328,373 filed on Jan. 9, 2006, which is a divisional of U.S.Pat. No. 7,073,099, which claims from the benefit of U.S. ProvisionalApplication No. 60/384,371, filed May 30, 2002. The disclosures arehereby incorporated by reference in their entirety.

FIELD

The present disclosure relates to memory circuits, and more particularlyto methods and apparatus for improving the yield and/or operation ofembedded and external memory circuits.

BACKGROUND

The Background description provided herein is for the purpose ofgenerally presenting the context of the disclosure. Work of thepresently named inventors, to the extent it is described in thisbackground section, as well as aspects of the description which may nototherwise qualify as prior art at the time of filing, are neitherexpressly or impliedly admitted as prior art against the presentdisclosure.

As the capacity of semiconductor memory continues to increase, attaininga sufficiently high yield becomes more difficult. To attain highermemory capacity, the area of a memory chip can be increased toaccommodate a greater number of memory cells. Alternately, the densityof the chip can be increased. Increasing the density involves reducingthe size and increasing the quantity of memory cells on the chip, whichleads to a proportional increase in defects.

To improve the yield, a number of techniques may be employed to fix orto compensate for the defects. A relatively expensive technique that iscommonly used for repairing standard memory chips is a wafer test, sortand repair process. The capital equipment costs for burn-in and testfacilities are relatively high, which can be amortized when the standardmemory chips are produced in sufficiently large quantities. For lowerproduction quantities, the amortized capital equipment costs oftenexceed the cost of scrapping the defective chips.

Embedded memory devices also face problems with attaining sufficientchip yield. Embedded memory devices combine logic and memory on a singlesilicon wafer and are not usually manufactured in large quantities. Thewafer sort/test fixtures, burn-in fixtures, and repair facilities thatare typically used with large quantity standard memory devices are noteconomically feasible. When a defect occurs on an embedded device, thedevice is typically scrapped.

Embedded devices typically have more defects per unit of memory thanstandard memory. This is due in part to the fact that the processingtechnology that is used for the logic is typically not compatible withthe processing technology that is used for the memory. The majority ofdefects in an embedded device occur in the memory since most of the chiparea is used for the memory. Typically, the prime yield is about 20% forconventional logic devices.

Referring now to FIG. 1, systems on chip (SOC) 10 typically include bothlogic 12 and embedded memory 14 that are fabricated on a single wafer ormicrochip. For example, the SOC 10 may be used for a disk drive andinclude read channels, a hard disk controller, an Error CorrectionCoding (ECC) circuit, high speed interfaces, and system memory. Thelogic 12 may include standard logic module(s) that are provided by themanufacturer and/or logic module(s) that are designed by the customer.The embedded memory 14 typically includes static random access memory(SRAM), dynamic random access memory (DRAM), and/or nonvolatile memorysuch as flash memory.

Referring now to FIG. 2, low chip yield is due in part to the small sizeof the memory cells in the embedded memory 14. The small memory cellsare used to reduce the chip size and lower cost. Typical defects includerandom single bit failures that are depicted at 16. For a 64 Mb memorymodule, on the order of 1000 random single bit failures 16 may occur.Other defects include bit line defects that are depicted at 18 and 20.While bit and word line defects occur less frequently than the randomsingle bit failures 16, they are easier and less costly to fix.

Referring now to FIG. 3, the embedded memory 14 typically includes arandom data portion 24 and a cache data portion 26. Bits that are storedin the random data portion 24 are accessed individually. In contrast,bits that are stored in the cache data portion 26 are accessed in blockshaving a minimum size such as 16 or 64 bits.

To improve reliability, an error correction coding (ECC) circuit 28 maybe used. ECC coding bits 30 are used for ECC coding. For example, 2additional bits are used for 16 bits and 8 additional bits are used for64 bits. The ECC circuit 28 requires the data to be written to and readfrom the embedded memory 14 in blocks having the minimum size.Therefore, the ECC circuit 28 and error correction coding/decodingcannot be used for the random data portion 24. When accessing the randomdata portion 24, the ECC coding circuit 28 is disabled as isschematically illustrated at 32. ECC coding bits also increase the costof fabricating the memory and reduce access times.

Because each of the bits in the random data portion 24 can be readindividually, single bit failures in the random data portion 24 areproblematic. During the wafer sort tests, if single bit failures aredetected in the random data portion 24, repair of the SOC 10 must beperformed, which significantly increases the cost of the SOC 10.

Memory such as dynamic random access memory (DRAM) and/or other memorytypes includes memory cells that may include a capacitor, a transistorand/or other charge storage device. When the memory cell is charged, thecell stores a “1” bit and when the memory cell is not charged the memorycell stores a “0” bit (or vice versa). Memory cells may be arranged indata blocks such as pages that include multiple memory cells.

The charge of the memory cell tends to leak over time. Therefore, thistype of memory cell needs to be refreshed on a periodic basis. Memorysystems rely on the ability of the memory cells to maintain a chargeduring periods between the refresh. If the memory cells are unable tomaintain a sufficient charge during the periods between the memoryrefresh, data will be lost. Some systems perform refresh one data blockor page at a time. Testing may be performed to ensure that the memorycells are able to maintain a sufficient charge during the periodsbetween the memory refresh.

It takes many milliseconds to find weak memory cells in the memory IC.During the testing time, normal access to the memory cells must besuspended. When suspending refresh to a particular memory cell, theentire memory data block or page containing the memory cell must also besuspended.

SUMMARY

A memory module comprises first memory that stores data in memoryblocks; second memory that temporarily stores data from at least one ofthe memory blocks and third memory for storing a relationship betweenaddresses of the at least one of the memory blocks in the first memoryand corresponding addresses of the data from the at least one of thememory blocks in the second memory. Storage capacities of the second andthird memories are less than a storage capacity of the first memory. Acontrol module selectively transfers data in the at least one of thememory blocks in the first memory to the second memory and stores andretrieves data from the second memory for the at least one of the memoryblocks based on the relationship during the testing.

In other features, a content addressable memory (CAM) stores addressesof defective memory locations in the first memory and stores andretrieves data for the defective memory locations. The first memorycommunicates with read data and address buses. The control moduleselectively generates a first match signal when a read address on theread address bus matches an address stored in the third memory andoutputs read data from the second memory corresponding to the address. Amultiplexer selectively outputs the read data to the read data bus fromthe second memory based on the first match signal.

In other features, a content addressable memory (CAM) communicates withthe read address and data buses and the multiplexer. The CAM selectivelygenerates a second match signal when the read address on the read databus matches a stored address in the CAM and outputs data associated withthe stored address to the multiplexer. The CAM has a memory capacitythat is smaller than said at least one of said memory blocks. Write dataand address buses communicate with the first memory. The control moduleselectively generates a first match signal when a write address on thewrite address bus matches an address stored in the third memory. Amultiplexer selectively writes data from the write address bus to thesecond memory based on the first match signal. A content addressablememory (CAM) communicates with the write address and data buses and themultiplexer. The CAM selectively generates a second match signal when awrite address on the write data bus matches a stored address in the CAM,writes data to the CAM and associates the write address from the writedata bus. The CAM has a capacity that is smaller than the at least oneof the memory blocks. A fully buffered dual in line memory module (FBDIMM) comprises the memory module.

In other features, a first buffer module buffers control signalsreceived from a memory control module for the memory module. At leastone of the control module, the second memory, the third memory and themultiplexer are integrated with the first buffer module in an integratedcircuit. Y memory integrated circuits (ICs) that communicate with thefirst buffer module, where Y is an integer greater than one. Z memorymodules each comprising a buffer module, wherein the buffer modules ofZ-1 of the Z memory modules communicate with a preceding one of the Zmemory modules, and wherein the buffer module of a first one of the Zmemory modules communicates with the first buffer module, and where Z isan integer greater than zero. Each of the memory blocks comprises a pageof data. The first, second and third memories and the control module arearranged on a printed circuit board. The printed circuit board includesan edge connector. A device comprises the memory module and a slot thatreceives the edge connector. The control module tests the at least onememory block.

A method for operating a memory module comprises storing data in memoryblocks of a first memory; temporarily storing data from at least one ofthe memory blocks second memory; storing a relationship betweenaddresses of the at least one of the memory blocks in the first memoryand corresponding addresses of the data from the at least one of thememory blocks in the second memory in a third memory, wherein storagecapacities of the second and third memories are less than a storagecapacity of the first memory; selectively transferring data in the atleast one of the memory blocks in the first memory to the second memory;and storing and retrieving data from the second memory for the at leastone of the memory blocks based on the relationship during the testing.

In other features, the method includes storing addresses of defectivememory locations in the first memory in a content addressable memory(CAM); and storing and retrieving data for the defective memorylocations using the CAM. The method includes providing a read data busand a read address bus; selectively generating a first match signal whena read address on the read address bus matches an address stored in thethird memory and outputs read data from the second memory correspondingto the address; and selectively outputting the read data to the readdata bus from the second memory based on the first match signal.

In other features, the method includes providing a content addressablememory (CAM) that communicates with the read address and data buses andthe multiplexer. The CAM selectively generates a second match signalwhen the read address on the read data bus matches a stored address inthe CAM and outputs data associated with the stored address to themultiplexer. The CAM data block has a memory capacity that is smallerthan the at least one of the memory blocks. The method includesproviding a write data bus and a write address bus; selectivelygenerating a first match signal when a write address on the writeaddress bus matches an address stored in the third memory; andselectively writing data from the write address bus to the second memorybased on the first match signal.

In other features, the method includes providing a content addressablememory (CAM) that communicates with the write address and data buses andthe multiplexer. The CAM selectively generates a second match signalwhen a write address on the write data bus matches a stored address inthe CAM, writes data to the CAM and associates the write address fromthe write data bus. The CAM has a capacity that is smaller than the atleast one of the memory blocks. The method includes providing a firstbuffer module that buffers control signals received from a memorycontrol module for the memory module. At least one of the controlmodule, the second memory, the third memory and the multiplexer areintegrated with the first buffer module in an integrated circuit. Eachof the memory blocks comprises a page of data.

In other features, the method includes arranging the first, second andthird memories and the control module on a printed circuit board thatincludes an edge connector. The control module tests the at least onememory block.

A memory module comprises first storing means for storing data in memoryblocks; second storing means for temporarily storing data from at leastone of the memory blocks; third storing means for storing a relationshipbetween addresses of the at least one of the memory blocks in the firststoring means and corresponding addresses of the data from the at leastone of the memory blocks in the second storing means, wherein storagecapacities of the second and third storing means are less than a storagecapacity of the first storing means; and control means for selectivelytransferring data in the at least one of the memory blocks in the firststoring means to the second storing means and for storing and retrievingdata from the second storing means for the at least one of the memoryblocks based on the relationship during the testing.

In other features, content addressable storing means for storingaddresses of defective memory locations in the first storing means andfor storing and retrieving data for the defective memory locations. Thefirst storing means communicates with read data and address buses. Thecontrol means selectively generates a first match signal when a readaddress on the read address bus matches an address stored in the thirdstoring means and outputs read data from the second storing meanscorresponding to the address. Multiplexing means selectively receivesthe first match signal and outputs the read data to the read data busfrom the second storing means when the first match signal is generated.Content addressable storing means stores data and communicates with theread address and data buses and the multiplexer. The content addressablestoring means selectively generates a second match signal when the readaddress on the read data bus matches a stored address in the contentaddressable storing means and outputs data associated with the storedaddress to the multiplexer. The content addressable storing means has amemory capacity that is smaller than the at least one of the memoryblocks.

In other features, write data and address buses communicate with thefirst storing means. The control means selectively generates a firstmatch signal when a write address on the write address bus matches anaddress stored in the third storing means. Multiplexing meansselectively receives the first match signal and for writing data fromthe write address bus to the second storing means when the first matchsignal is generated. Content addressable storing means stores data andcommunicates with the write address and data buses and the multiplexer.The content addressable storing means selectively generates a secondmatch signal when a write address on the write data bus matches a storedaddress and writes data and associates the stored address with the data.The content addressable storing means has a capacity that is smallerthan the at least one of the memory blocks.

In other features, a fully buffered dual in line memory module (FB DIMM)comprises the memory module. First buffer means buffers control signals.At least one of the control means, the second storing means, the thirdstoring means and the multiplexing means are integrated with the firstbuffer means in an integrated circuit. Y memory integrated circuits(ICs) communicate with the first buffer means, where Y is an integergreater than one. Z memory modules each comprising buffer means forbuffering. The buffer means of Z-1 of the Z memory modules communicatewith a preceding one of the Z memory modules. The buffer means of afirst one of the Z memory modules communicates with the first buffermeans, where Z is an integer greater than zero. Each of the memoryblocks comprises a page of data. The first, second and third memorymeans and the control means are arranged on a printed circuit board. Theprinted circuit board includes an edge connector. A device comprises thememory module and a slot that receives the edge connector. The controlmeans tests the at least one memory block.

A memory module comprises first memory that includes memory blocks,second memory, and non-volatile memory. A control module stores datafrom the at least one of the memory blocks in the second memory at asecond address and stores the first and second addresses in thenon-volatile memory during testing of at least one of the memory blockshaving a first address. Content addressable memory (CAM) that storesaddresses of defective memory locations in the first memory and storesand retrieves data for the defective memory locations.

In other features, storage capacities of the second and non-volatilememories are less than a storage capacity of the first memory. The CAMhas a memory capacity that is smaller than the at least one of thememory blocks. The control module selectively tests the at least one ofthe memory blocks. The first memory communicates with read data andaddress buses. The control module selectively generates a first matchsignal when a read address on the read address bus matches an addressstored in the non-volatile memory and outputs read data from the secondmemory corresponding to the address. A multiplexer selectively outputsthe read data to the read data bus from the second memory based on thefirst match signal. The CAM communicates with the read address and databuses and the multiplexer. The CAM selectively generates a second matchsignal when the read address on the read data bus matches a storedaddress in the CAM and outputs data associated with the stored addressto the multiplexer.

In other features, write data and address buses communicate with thefirst memory. The control module selectively generates a first matchsignal when a write address on the write address bus matches an addressstored in the non-volatile memory. A multiplexer selectively writes datafrom the write address bus to the second memory based on the first matchsignal. The CAM selectively generates a second match signal when a writeaddress on the write data bus matches a stored address in the CAM andwrites data to the CAM and associates the stored address with the data.A fully buffered dual in line memory module (FB DIMM) comprises thememory module.

In other features, a first buffer module buffers control signals. Atleast one of the control module, the second memory, the non-volatilememory are integrated with the first buffer module in an integratedcircuit. Y memory integrated circuits (ICs) that communicate with thefirst buffer module, where Y is an integer greater than one. Z memorymodules each comprising a buffer module, wherein the buffer modules ofZ-1 of the Z memory modules communicate with a preceding one of the Zmemory modules, and wherein the buffer module of a first one of the Zmemory modules communicates with the first buffer module, and where Z isan integer greater than zero. Each of the memory blocks comprises a pageof data. The first, second and non-volatile memories and the controlmodule are arranged on a printed circuit board that includes an edgeconnector. A device comprises the memory module and a slot that receivesthe edge connector.

A method for operating a memory module comprises providing a firstmemory that includes memory blocks, a second memory, and non-volatilememory; during testing of at least one of the memory blocks having afirst address, storing data from the at least one of the memory blocksin the second memory at a second address and storing the first andsecond addresses in the non-volatile memory; storing addresses ofdefective memory locations in the first memory in content addressablememory (CAM); storing and retrieving data for the defective memorylocations from the CAM.

In other features, storage capacities of the second and non-volatilememories are less than a storage capacity of the first memory. The CAMhas a memory capacity that is smaller than the at least one of thememory blocks. The control module selectively tests the at least one ofthe memory blocks. The method further comprises providing a read databus and a read address bus; selectively generating a first match signalwhen a read address on the read address bus matches an address stored inthe non-volatile memory and outputs read data from the second memorycorresponding to the address; selectively outputting the read data tothe read data bus from the second memory based on the first matchsignal; and selectively generating a second match signal when the readaddress on the read data bus matches a stored address in the CAM andoutputting data associated with the stored address from the CAM to themultiplexer.

In other features, the method comprises providing a write data bus and awrite address bus; selectively generating a first match signal when awrite address on the write address bus matches an address stored in thenon-volatile memory; and selectively writing data from the write addressbus to the second memory based on the first match signal. The CAMselectively generates a second match signal when a write address on thewrite data bus matches a stored address in the CAM and writes data tothe CAM and associates the stored address with the data in the CAM. Themethod comprises providing a first buffer that buffers control signalsreceived from a memory controller for the memory module. The methodcomprises integrating at least one of the control module, the secondmemory, the non-volatile memory with the first buffer module in anintegrated circuit. Each of the memory blocks comprises a page of data.

A memory module comprises first storing means for storing data as memoryblocks; second storing means for storing data; and non-volatile storingmeans for storing data. Control means stores data from the at least oneof the memory blocks in the first memory at a first address in thesecond storing means at a second address and stores the first and secondaddresses in the non-volatile storing means during testing of at leastone of the storing memory blocks having a first address. Contentaddressable storing means stores addresses of defective memory locationsin the first storing means and for storing and retrieving data for thedefective memory locations.

In other features, storage capacities of the second and non-volatilemeans are less than a storage capacity of the first storing means. Thecontent addressable storing means has a memory capacity that is smallerthan the at least one of the memory blocks. The control meansselectively tests the at least one of the memory blocks. The firststoring means communicates with read data and address buses. The controlmeans selectively generates a first match signal when a read address onthe read address bus matches an address stored in the non-volatilestoring means and outputs read data from the second storing meanscorresponding to the read address. Multiplexing means outputs the readdata to the read data bus from the second storing means based on thefirst match signal. The content addressable storing means communicateswith the read address and data buses and the multiplexer. The contentaddressable storing means selectively generates a second match signalwhen the read address on the read data bus matches a stored address inthe content addressable storing means and outputs data associated withthe stored address to the multiplexer.

In other features, write data and address buses communicate with thefirst storing means. The control means selectively generates a firstmatch signal when a write address on the write address bus matches anaddress stored in the non-volatile storing means. Multiplexing meanswrites data from the write address bus to the second storing means basedon the first match signal. The content addressable storing meansselectively generates a second match signal when a write address on thewrite data bus matches a stored address in the content addressablestoring means and writes data to the content addressable storing meansand associates the stored address with the data. A fully buffered dualin line memory module (FB DIMM) comprises the memory module.

In other features, first buffer means buffers control signals. At leastone of the control means, the second storing means, the non-volatilestoring means are integrated with the first buffer means in anintegrated circuit. Y memory integrated circuits (ICs) communicate withthe first buffer means, where Y is an integer greater than one. Z memorymodules each comprising buffer means for buffering. The buffer means ofZ-1 of the Z memory modules communicates with a preceding one of the Zmemory modules. The buffer means of a first one of the Z memory modulescommunicates with the first buffer means, where Z is an integer greaterthan zero. Each of the memory blocks comprises a page of data. Thefirst, second and non-volatile means and the control means are arrangedon a printed circuit board that includes an edge connector. A devicecomprises the memory module and a slot that receives the edge connector.

A memory system comprises first memory that includes memory cells.Content addressable memory (CAM) includes CAM memory cells, storesaddresses of selected ones of the memory cells, stores data having theaddresses in corresponding ones of the CAM memory cells and retrievesdata having the addresses from corresponding ones of the CAM memorycells. An adaptive refresh module stores data from selected ones of thememory cells in the CAM memory cells to one of increase and maintain atime period between refreshing of the memory cells.

In other features, the adaptive refresh module uses G of the CAM memorycells to store data from G of the memory cells to maintain a time periodbetween refreshing of the memory cells, where G is an integer greaterthan or equal to one. The adaptive refresh module uses H of the CAMmemory cells to store data from H of the memory cells where H is aninteger greater than or equal to one and selectively increases a timeperiod between refreshing of the memory cells. A testing modulecommunicates with the first memory and the adaptive refresh module andtests the memory cells using at least one refresh rate.

In other features, the memory system further comprises second memory andnon-volatile memory, wherein the first memory includes memory blocks. Acontrol module stores data from the at least one of the memory blocks inthe second memory at a second address and stores the first and secondaddresses in the non-volatile memory during testing of at least one ofthe memory blocks having a first address. In other features, storagecapacities of the second and non-volatile memories are less than astorage capacity of the first memory.

In other features, the CAM has a memory capacity that is smaller thanthe at least one of the memory blocks. The control module selectivelytests the at least one of the memory blocks. A fully buffered dual inline memory module (FB DIMM) comprises the memory system. A first buffermodule buffers control signals. At least one of the control module, thesecond memory, the non-volatile memory and the CAM are integrated withthe first buffer module in an integrated circuit. Y memory integratedcircuits (ICs) communicate with the first buffer module, where Y is aninteger greater than one. Z memory modules each comprise a buffermodule, wherein the buffer modules of Z-1 of the Z memory modulescommunicate with a preceding one of the Z memory modules, and whereinthe buffer module of a first one of the Z memory modules communicateswith the first buffer module, and where Z is an integer greater thanzero. Each of the memory blocks comprises a page of data. The first,second and non-volatile memories and the control module are arranged ona printed circuit board that includes an edge connector.

A method for operating a memory system comprises providing a firstmemory that includes memory cells and content addressable memory (CAM)that includes CAM memory cells; storing addresses of selected ones ofthe memory cells in the CAM; storing data having the addresses incorresponding ones of the CAM memory cells; retrieving data having theaddresses from corresponding ones of the CAM memory cells; and storingdata from selected ones of the memory cells in the CAM memory cells toone of increase and maintain a time period between refreshing of thememory cells.

In other features, the method comprises using G of the CAM memory cellsto store data from G of the memory cells to maintain a time periodbetween refreshing of the memory cells, where G is an integer greaterthan or equal to one. The method includes using H of the CAM memorycells to store data from H of the memory cells where H is an integergreater than or equal to one. The method includes selectively increasinga time period between refreshing of the memory cells. The methodincludes testing the memory cells using at least one refresh rate.

In other features, the first memory includes memory blocks. The methodfurther includes providing a second memory and non-volatile memory;during testing of at least one of the memory blocks having a firstaddress, storing data from the at least one of the memory blocks in thesecond memory at a second address and storing the first and secondaddresses in the non-volatile memory; storing addresses of defectivememory locations in the first memory in content addressable memory(CAM); and storing and retrieving data for the defective memorylocations from the CAM. Storage capacities of the second andnon-volatile memories are less than a storage capacity of the firstmemory. The CAM has a memory capacity that is smaller than the at leastone of the memory blocks. The control module selectively tests the atleast one of the memory blocks.

The method further includes providing a first buffer that bufferscontrol signals received from a memory controller for the memory system;and integrating at least one of the second memory and the non-volatilememory with the first buffer module in an integrated circuit. Each ofthe memory blocks comprises a page of data.

A memory system comprises first storing means for storing data and thatincludes memory cells; content addressable storing means for providingsecond memory cells, for storing addresses of selected ones of thememory cells, for storing data having the addresses in correspondingones of the second memory cells and for retrieving data having theaddresses from corresponding ones of the second memory cells; andadaptive refresh means for storing data from selected ones of the memorycells in the second memory cells to one of increase and maintain a timeperiod between refreshing of the memory cells.

In other features, the adaptive refresh means uses G of the secondmemory cells to store data from G of the memory cells to maintain a timeperiod between refreshing of the memory cells, where G is an integergreater than or equal to one. The adaptive refresh means uses H of thesecond memory cells to store data from H of the memory cells where H isan integer greater than or equal to one and selectively increases a timeperiod between refreshing of the memory cells. Testing meanscommunicates with the first storing means and the adaptive refresh meansfor testing the memory cells using at least one refresh rate.

In other features, the first storing means stores data as memory blocksand further comprises second storing means for storing data andnon-volatile storing means for storing data. Control means stores datafrom the at least one of the memory blocks in the first memory at afirst address in the second storing means at a second address and storesthe first and second addresses in the non-volatile storing means duringtesting of at least one of the storing memory blocks having a firstaddress. The content addressable storing means stores addresses ofdefective memory locations in the first storing means and stores andretrieves data for the defective memory locations. Storage capacities ofthe second and non-volatile means are less than a storage capacity ofthe first storing means. The content addressable storing means has amemory capacity that is smaller than the at least one of the memoryblocks. The control means selectively tests the at least one of thememory blocks.

In other features, a fully buffered dual in line memory module (FB DIMM)comprises the memory system. First buffer means buffers control signals.At least one of the control means, the second storing means, thenon-volatile storing means and the content addressable storing means areintegrated with the first buffer means in an integrated circuit. Ymemory integrated circuits (ICs) communicate with the first buffermeans, where Y is an integer greater than one. Z memory modules eachcomprise buffer means for buffering, wherein the buffer means of Z-1 ofthe Z memory modules communicates with a preceding one of the Z memorymodules, and wherein the buffer means of a first one of the Z memorymodules communicates with the first buffer means, and where Z is aninteger greater than zero. Each of the memory blocks comprises a page ofdata. The first, second and non-volatile means and the control means arearranged on a printed circuit board that includes an edge connector.

A memory system comprises first memory that includes memory cells thatare selectively refreshed at a refresh rate. A test module testsoperation of the memory cells at the refresh rate and identifies T ofthe memory cells that are inoperable when refreshed at the refresh rate,where T is an integer greater than zero. Content addressable memory(CAM) includes D CAM memory cells where D is an integer greater than orequal to one. An adaptive refresh module selectively adjusts a refreshrate of the first memory based on T and D.

In other features, the adaptive refresh module increases the refreshrate of the first memory when T is greater than D. The adaptive refreshmodule decreases the refresh rate of the first memory when T is lessthan a first threshold, wherein the first threshold is less than D. Theadaptive refresh module decreases the refresh rate of the first memorywhen T is greater than the first threshold and less than a secondthreshold, wherein the second threshold is greater than the firstthreshold and less than D. The adaptive refresh module maintains therefresh rate of the first memory when T is greater than the secondthreshold and less than D. The CAM stores addresses of the T memorycells, stores data having the addresses in T of the D CAM memory cellsand retrieves data having the addresses from the T of the D CAM memorycells. The adaptive refresh module uses T of the D CAM memory cells forstoring data from the T memory cells to maintain a time period betweenrefreshing of the memory cells. The adaptive refresh module uses T ofthe D CAM memory cells for storing data from the T memory cells andselectively increases a time period between refreshing of the memorycells.

In other features, the memory system further comprises second memory andnon-volatile memory, wherein the first memory includes memory blocks. Acontrol module stores data from the at least one of the memory blocks inthe second memory at a second address and stores the first and secondaddresses in the non-volatile memory during testing of at least one ofthe memory blocks having a first address. Each of the memory blockscomprises a page of data.

A method for operating a memory system comprises providing a firstmemory that includes memory cells that are selectively refreshed at arefresh rate; testing operation of the memory cells at the refresh rateto identify T of the memory cells that are inoperable when refreshed atthe refresh rate, where T is an integer greater than zero; providingcontent addressable memory (CAM) that includes D CAM memory cells whereD is an integer greater than or equal to one; and selectively adjustinga refresh rate of the first memory based on T and D.

In other features, the method includes selectively increasing therefresh rate of the first memory when T is greater than D. The methodincludes selectively decreasing the refresh rate of the first memorywhen T is less than a first threshold, wherein the first threshold isless than D. The method includes selectively decreasing the refresh rateof the first memory when T is greater than the first threshold and lessthan a second threshold, wherein the second threshold is greater thanthe first threshold and less than D. The method includes maintaining therefresh rate of the first memory when T is greater than the secondthreshold and less than D.

In other features, the method includes storing addresses of the T memorycells in the CAM; storing data having the addresses in the T of the DCAM memory cells; and retrieving data having the addresses from the T ofthe D CAM memory cells. The method includes using T of the D CAM memorycells for storing data from the T memory cells to maintain a time periodbetween refreshing of the memory cells. The method includes using T ofthe D CAM memory cells for storing data from the T memory cells; andselectively increasing a time period between refreshing of the memorycells.

In other features, the method includes providing second memory andnon-volatile memory, wherein the first memory includes memory blocks;and storing data from the at least one of the memory blocks in thesecond memory at a second address and storing the first and secondaddresses in the non-volatile memory during testing of at least one ofthe memory blocks having a first address. Each of the memory blockscomprises a page of data.

A memory system comprises first storing means for storing data and forproviding memory cells that are selectively refreshed at a refresh rate;test means for testing operation of the memory cells at the refresh rateand for identifying T of the memory cells that are inoperable whenrefreshed at the refresh rate, where T is an integer greater than zero;content addressable storing means for storing data and for providing Dsecond memory cells where D is an integer greater than or equal to one;and adaptive refresh means for selectively adjusting a refresh rate ofthe first storing means based on T and D.

In other features, the adaptive refresh means increases the refresh rateof the first storing means when T is greater than D. The adaptiverefresh means decreases the refresh rate of the first storing means whenT is less than a first threshold, wherein the first threshold is lessthan D. The adaptive refresh means decreases the refresh rate of thefirst storing means when T is greater than the first threshold and lessthan a second threshold, wherein the second threshold is greater thanthe first threshold and less than D. The adaptive refresh meansmaintains the refresh rate of the first storing means when T is greaterthan the second threshold and less than D. The CAM stores addresses ofthe T memory cells, stores data having the addresses in T of the Dsecond memory cells and retrieves data having the addresses from the Tof the D second memory cells. The adaptive refresh means uses T of the Dsecond memory cells for storing data from the T memory cells to maintaina time period between refreshing of the memory cells. The adaptiverefresh means uses T of the D second memory cells for storing data fromthe T memory cells and selectively increases a time period betweenrefreshing of the memory cells.

In other features, the memory system includes second storing means forstoring data; non-volatile storing means for storing data in anon-volatile manner, wherein the first storing means includes memoryblocks; and control means for storing data from the at least one of thestoring means blocks in the second storing means at a second address andfor storing the first and second addresses in the non-volatile storingmeans during testing of at least one of the storing means blocks havinga first address. Each of the memory blocks comprises a page of data.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, whileindicating the preferred embodiment of the disclosure, are intended forpurposes of illustration only and are not intended to limit the scope ofthe disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thedetailed description and the accompanying drawings, wherein:

FIG. 1 is a functional block diagram of a system on chip (SOC) includinglogic and embedded memory that are fabricated on a microchip accordingto the prior art;

FIG. 2 illustrates defects in the embedded memory of FIG. 1;

FIG. 3 is a functional block diagram of a SOC including an errorcorrection coding circuit (ECC) according to the prior art;

FIGS. 4A and 4B are functional block diagrams illustrating a first SOCaccording to the present disclosure;

FIG. 5 is a functional block diagram illustrating a memory circuitaccording to the present disclosure;

FIG. 6 is a flowchart illustrating a method for operating the memory ofthe SOC of FIGS. 4A and 4B according to the present disclosure;

FIG. 7 is a functional block diagram of an embedded memory circuitaccording to the prior art;

FIG. 8 is a functional block diagram of an external memory circuitaccording to the prior art;

FIG. 9 is a functional block diagram of an embedded memory circuitaccording to the present disclosure;

FIG. 10 is a functional block diagram of an external memory circuitaccording to the present disclosure;

FIG. 11 is a flowchart illustrating steps performed by the memorycircuit according to the present disclosure for identifying defectivememory addresses;

FIG. 12 is a flowchart illustrating steps of one exemplary method foridentifying defective memory addresses;

FIGS. 13A and 13B are flowcharts illustrating steps for operating amemory circuit according to the present disclosure;

FIGS. 14A and 14B are a functional block diagrams of memory circuitswith a CAM, an ECC circuit and a second memory according to the presentdisclosure;

FIG. 15 is a flowchart illustrating the operation of the memory circuitsof FIG. 14;

FIGS. 16A and 16B are functional block diagrams of a memory circuitincluding a first memory and a second memory according to the presentdisclosure;

FIG. 17 is a functional block diagram of a memory module;

FIG. 18 is a functional block diagram of a memory module according tothe present disclosure;

FIG. 19 is a flowchart illustrating steps performed by the memory moduleof FIG. 18;

FIG. 20 is a functional block diagram illustrating operation of anexemplary memory module during a read operation;

FIG. 21 is a functional block diagram illustrating operation of anexemplary memory module during a write operation;

FIG. 22 is a functional block diagram of a memory module with an edgeconnector inserted in a slot of a host device;

FIG. 23 is a functional block diagram of a memory module with an edgeconnector inserted in a slot of computer;

FIG. 24 is a functional block diagram of an alternate memory module witha buffer and error correction module;

FIG. 25 is a functional block diagram of an alternate memory module;

FIGS. 26A and 26B are functional block diagrams of host devicesincluding memory modules;

FIGS. 27A and 27B are functional block diagrams of memory modules withadaptive refresh rate modules;

FIG. 28 is a flowchart illustrating exemplary steps for providing anadaptive refresh rate;

FIG. 29 is a flowchart illustrating exemplary steps for providing anadaptive refresh rate;

FIG. 30 is a flowchart illustrating exemplary steps for providing anadaptive refresh rate;

FIG. 31 is a flowchart illustrating exemplary steps for providing anadaptive refresh rate;

FIG. 32A is a functional block diagram of a hard disk drive;

FIG. 32B is a functional block diagram of a DVD drive;

FIG. 32C is a functional block diagram of a high definition television;

FIG. 32D is a functional block diagram of a vehicle control system;

FIG. 32E is a functional block diagram of a cellular phone;

FIG. 32F is a functional block diagram of a set top box; and

FIG. 32G is a functional block diagram of a mobile device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description of the preferred embodiment(s) is merelyexemplary in nature and is in no way intended to limit the disclosure,its application, or uses. For purposes of clarity, the same referencenumbers will be used in the drawings to identify similar elements. Asused herein, the term module, circuit and/or device refers to anApplication Specific Integrated Circuit (ASIC), an electronic circuit, aprocessor (shared, dedicated, or group) and memory that execute one ormore software or firmware programs, a combinational logic circuit,and/or other suitable components that provide the describedfunctionality. As used herein, the phrase at least one of A, B, and Cshould be construed to mean a logical (A or B or C), using anon-exclusive logical or. It should be understood that steps within amethod may be executed in different order without altering theprinciples of the present disclosure.

Referring now to FIGS. 4A and 4B, a system on chip (SOC) 50 according tothe present invention is shown. The SOC 50 includes logic 52, embeddedmemory 54, a swap circuit 56 and an error correction coding (ECC)circuit 58 that are fabricated on a single wafer or microchip. Theembedded memory 54 includes a random data portion 60 and a cache dataportion 62. The cache data portion 62 is divided into a plurality ofblocks 64-1, 64-2, . . . and 64-n. The size of the n blocks may be equalto, larger or smaller than the size of the random data portion 60. Ascan be appreciated, the random data portion 60 may also be divided intoblocks.

Initially, the random data portion 60 of the SOC 50 may be positioned ina first or top location in the embedded memory 54. If defects aredetected in the random data portion 60 during initial testing or laterin use, the random data portion 60 is swapped with one of the n blocks64 in the cache data portion 62. The defective block is preferablylogically moved to the end of the cache data portion 62 so that it isused less frequently. If the random data portion 60 is larger than theblocks 64, one or more blocks 64 may be used. Preferably, the size ofthe blocks 64 are an integer multiple of the size of the random dataportion 60.

For example in FIG. 4B, the location of the random data portion 60 hasbeen physically swapped with the first block 64-1. If additional defectsare subsequently detected in the random data portion 60, the random dataportion 60 can be physically swapped with other blocks in the cache dataportion 62. The block of embedded memory 54 that contains the randomdata portion 60 is tested to determine whether a defect exists. Thelocation of the defect is not important. If a defect exists, anotherblock within the embedded memory is used.

More specifically, the logic 52 generates a logical address (LA) that isoutput to the swap circuit 56. If a swap has not been performedpreviously, the swap circuit 56 uses the LA. Otherwise, the swap circuit56 substitutes a physical address (PA) for the LA. If the addresscorresponds to the random data portion 60, the swap circuit 56 disablesthe ECC circuit 58 (the random data portion 60 does not employ ECC). Ifthe address corresponds to the blocks 64 of the cache data portion 62,the swap circuit enables the ECC circuit 58 and error correction coding(ECC) is performed. A memory test circuit 68 can be provided to test thememory 54 during manufacturing, assembly, operation, and/or power up.Alternately, testing can be performed by logic circuit 52. As can beappreciated, testing of the other memory circuits disclosed below can beperformed in a similar manner.

Referring now to FIG. 5, a memory circuit 69 according to the presentinvention is shown. During read/write operations, address data from thelogic circuit 52 and/or a memory interface is input to a CAM 70 and amultiplexer 72. If the address matches an address stored in the CAM 70,the CAM 70 signals a matched address via match line 74. The CAM outputsa substitute address corresponding to the matched address. Themultiplexer 72 selects the substitute address from the CAM for output tomemory 80. If there is no match, the multiplexer 72 outputs the addressfrom logic 52. As can be appreciated, the memory 80 can be similar tomemory 54 in FIGS. 4A and 4B, standard memory, memory with ECC bits orany other electronic storage.

Referring now to FIG. 6, steps for operating the embedded memory 54 ofthe SOC 50 are shown generally at 100. Control begins with step 102. Instep 104, control determines whether the embedded memory 54 is beingaccessed by the logic 52. If not, control returns to step 104.Otherwise, control determines whether the logical address is in a swaptable of the swap circuit 56 in step 106. If it is, the swap circuit 56sets the address equal to the PA in the swap table in step 108.Otherwise, the address is set equal to the LA in step 110.

Control continues with step 112 where control determines whether theaddress is part of the cache data portion 62. If it is, controlcontinues with step 114 where the ECC circuit 58 is enabled. If not, theECC circuit 58 is disabled in step 116. Data is returned in step 118.

Referring now to FIG. 7, an embedded memory circuit 150 according to theprior art is shown. The embedded memory circuit 150 includes a memoryinterface 154 having address and control inputs 156 and 158,respectively, data input 160, and data output 162. The memory interface154 is connected to memory 166. The memory interface 154 and the memory166 are formed on a single wafer along with other logic (not shown).

Referring now to FIG. 8, an external memory circuit 170 according to theprior art is shown. The external memory circuit 170 includes a memoryinterface 174 having address and control inputs 176 and 178,respectively, data input 180, and data output 182. The memory interface174 is connected to a memory 186. The memory interface 174 and thememory 186 are not formed on a single wafer as indicated by dotted lines190. The memory interface 174 is connected to logic (not shown).

As can be appreciated, problems arise when memory locations in thememory 166 and 186 become defective. Error correction coding (ECC) canbe used when data is read from and written to the memory block in blocksof data such as 16 and 64 bits. However, additional ECC bits must beadded to each block of memory, which significantly increases the size ofthe memory. Additionally, ECC coding/decoding circuits must be added tothe memory circuits 150 and 170, which increases the cost of the memorycircuits. The coding/decoding algorithms also increase the read/writeaccess times.

Referring now to FIG. 9, an embedded memory circuit 200 according to thepresent invention is shown. The embedded memory circuit 200 includes afirst memory 202, a memory interface 204, and a second memory 206. Thesecond memory 206 includes semiconductor memory such as SDRAM, NRAM, orany other suitable memory. The first memory 202 includes first addressand control inputs 206 and 208, respectively, data input 212, and dataoutput 214. The memory interface 204 includes second address and controlinputs 220 and 222, respectively, data input 224, and data output 228.The first memory 202 is coupled to logic 229.

Referring now to FIG. 10, an external memory circuit 230 according tothe present invention is shown. The embedded memory circuit 230 includesa first memory 232, a memory interface 234, and a second memory 236. Ascan be appreciated, the first memory 232 and the memory interface 234are not formed on a single wafer or microchip as indicated by dottedlines 237. The first memory 232 includes first address and controlinputs 236 and 238, respectively, data input 242, and data output 244.The memory interface 244 includes second address and control inputs 250and 252, respectively, data input 254, and data output 258. The firstmemory 232 is connected to logic 259.

The first memory 202 and 232 is preferably Content Addressable Memory(CAM) or associative memory. CAM is a storage device that can beaddressed by its own contents. Each bit of CAM storage includescomparison logic. An address input to the CAM is simultaneously comparedwith all of the stored addresses. The match result is the correspondingdata for the matched address. The CAM operates as a data parallelprocessor. CAMs have a performance advantage over other memory searchalgorithms. This is due to the simultaneous comparison of the desiredinformation against the entire list of stored entries. While CAM ispreferably employed, the first memory 202 and 232 can be standardmemory, logic, or any other suitable electronic storage medium.

Referring now to FIG. 11, steps that are performed by the memorycircuits illustrated in FIGS. 9 and 10 during startup are shown. Controlbegins with step 270. In step 272, control determines whether the memorycircuit is powered up. If not, control loops to step 272. Otherwise,control continues with step 274 where control determines whether a testof the second memory is requested.

If step 274 is true, control continues with step 275 where the secondmemory is placed in a stress mode or condition. In step 276, the firstmemory is disabled. In step 277, a memory location in the second memoryis tested. In step 278, control determines whether the memory locationis defective. If it is, control stores the address of the defectiveaddress and/or block in the first memory in step 280. Control continuesfrom steps 278 (if false) and step 280 with step 284. In step 284,control determines whether all memory locations in the second memory arechecked. If not, control identifies a next memory location in step 286and returns to step 276. Otherwise, control sets the second memory tonormal mode and enables the first memory in step 290. Control ends instep 292.

Referring now to FIG. 12, one exemplary method for testing memorylocations in the second memory is shown at 300. Control begins with step302. In step 304, a special pattern/data is written to a memorylocation. In step 306, the special pattern/data is read from the memorylocation. In step 310, control determines whether the write data isequal to the read data. If not, control continues with step 312 wherethe memory location is flagged as defective. The address of thedefective location(s) are stored in the first memory. Control continuesfrom step 310 (if true) and step 312 with step 314 where control ends.

As can be appreciated, testing of the memory storing the data in thememory circuits according to the present invention may be performedduring manufacture and/or assembly, when the second memory is firststarted up, every time the second memory is started up, periodically, orrandomly during subsequent startups. Testing may be performed by logicsuch as the logic 229 and/or by an external testing device. As can beappreciated by skilled artisans, still other criteria may be used forscheduling testing. In addition, all or part of the second memory may betested.

After identifying defective locations in the second memory and storingthe corresponding memory addresses in the first memory, the memorycircuit operates as depicted generally at 320 in FIGS. 13A and 320′ inFIG. 13B. In FIG. 13A, control begins with step 322. In step 324,control determines whether data is being written to the second memory.If it is, control determines whether the write data address is equal toan address in the first memory in step 328. If it is, the data iswritten to the address stored in the first memory. If the address is notin the first memory, control continues with step 334 where the data iswritten to the address in the second memory. In another alternateembodiment, data can also be written to the original address in thesecond memory (even if bad) to simplify the memory circuit. If data isto be read from the second memory as determined in step 340, controldetermines whether the read data address is equal to an address in thefirst memory in step 342. If it is, control continues with step 344 andreads data from the address in the first memory. Otherwise controlcontinues with step 346 and reads data from the address in the secondmemory.

Referring now to FIG. 13B, an alternate method is shown at 320′. If thewrite address is in the first memory as determined in step 328, data iswritten to a new and non-defective location in the second memory using anew address specified by the first memory in step 330′. If the readaddress is in the first memory as determined in step 342, data is readfrom the new location in the second memory using new address specifiedby the first memory in step 344′. In FIGS. 13A and 13B, data can bewritten to the original memory address (even if bad) to simplify thecircuit.

Referring now to FIG. 14A, a read operation in a memory circuit 350according to the present invention is shown. The memory circuit 350provides error correction coding (ECC) for defective memory locationsfound in a second memory 360. The memory circuit 350 includes logic 352that is coupled to a memory interface 354. An address line of the memoryinterface 354 is coupled to CAM 356 and memory 360. The memory 360includes memory locations 364-1, 364-2, . . . and 364-n. The CAMincludes m memory locations. In a preferred embodiment, n>>m. The CAM356 is preferably less than 5% of the size of the second memory 360. Forexample, the CAM 356 is approximately 1% of the size of the secondmemory 360.

The CAM 356 is coupled to an ECC circuit 366. An output of the ECCcircuit is coupled to a multiplexer 370. When an address is output bythe memory interface 354 to the second memory 360, the CAM 356 comparesthe address to stored addresses. If a match is found, the CAM 356outputs a match signal to the multiplexer 370 and ECC bits to the ECCcircuit 366. The ECC circuit 366 and the multiplexer also receive thedata from the second memory 360. The ECC circuit 370 uses ECC bits fromthe CAM 356 and outputs data to the multiplexer 370. The multiplexer 370selects the output of the ECC circuit 370 when a match occurs. Themultiplexer 370 selects the output of the second memory 360 when a matchdoes not occur.

As can be appreciated, the memory is 360 preferably CAM. However, othertypes of memory such as SDRAM, DRAM, SRAM, and/or any other suitableelectronic storage media can be used for the memory 360 instead of theCAM. The first memory 360 may be fabricated on a first microchip with atleast one of the logic circuit 352, the memory interface 354, and theECC circuit 366. The second memory 360 can be fabricated on a secondmicrochip or on the first microchip.

Referring now to FIG. 14B, the memory circuit 350 for a write operationis shown. The memory interface 354 outputs a write address to the secondmemory 360. If the address matches an address stored in the CAM 356, theCAM 356 stores the ECC bits generated by the ECC circuit 366 in alocation associated with the matched address.

Referring now to FIG. 15, steps for operating the memory circuits 350 ofFIGS. 14A and 14B are shown generally at 400. Control begins with step402. In step 404, control determines whether data is to be written fromthe logic 352 to the second memory 360. If step 404 is true, controlcontinues with step 405 where control determines whether the address isdefective. In not, control continues with step 406 and reads the datafrom the address in the memory. If step 405 is true, control continueswith step 407 where the ECC 366 generates ECC bits. In step 408, the ECCbits are written to the CAM 356. In step 410, the data is written to thesecond memory 360.

If the result of step 404 is false, control continues with step 412. Instep 412, control determines whether data is to be read from the secondmemory 360. If true, control continues with step 413 where controldetermines whether the address is defective. If not, control continueswith step 414 and reads the data from the memory. Otherwise, controlcontinues with step 416 where ECC bits are read from the CAM 356. Instep 418, data is read from the second memory 360. The ECC 356 performserror correction coding on the data using the ECC bits in step 420. Instep 422, the data is output to the logic 352. If step 412 is false,control returns to step 404.

For referring now to FIG. 16A, a memory circuit 400 is illustrated. Amemory interface 404 is coupled to a first memory 406 that includes aplurality of memory locations 414-1, 414-2, . . . , and 414-n. Thememory interface 404 is typically connected to logic 408. A secondmemory 416 includes a plurality of memory locations 418-1, 418-2, . . ., and 418-m. The second memory 416 is coupled to an address line 422.The second memory 416 is also coupled to a multiplexer 424. Themultiplexer 424 is connected to a read data line 428 from the firstmemory 406. A control line 430 or match line connects the second memory416 to the multiplexer 424. As with the memory circuit in FIG. 14, n>>m.

In use, the second memory 416 monitors addresses transmitted on theaddress line 422 to the first memory 406. If the second memory 416 has amatching address, the second memory 416 generates a control signal viathe control line 430 and outputs the corresponding data to themultiplexer 424. The data is routed by the multiplexer 424 to the memoryinterface 404.

Referring now to FIG. 16B, the memory circuit 400′ is illustrated duringa write data operation. The second memory 416 monitors the address line422. If the address matches an address stored in the second memory 416,the second memory 416 writes the data to a location corresponding to thematched address in the second memory 416. To simplify the memory circuit400′, the data can be optionally written to the first memory as well.The first memory 406 can be ECC memory with ECC bits.

As can be appreciated, the present invention contemplates using CAM forthe memory 202, 232, 358, and 416 to provide optimum memory accesstimes. However, any other suitable electronic storage medium may be usedsuch as DRAM, SRAM, SDRAM, etc. The ECC and control circuit 356 may becombinatorial ECC.

As can be appreciated, the memory that stores the data can be tested fordefects at the time of manufacture, at the time of assembly, duringoperation, at power up or at any other suitable time.

Referring now to FIG. 17, a functional block diagram of a memory module500 is shown. A memory control module 510 selectively sends data storingand data retrieval commands to one of a plurality of memory modules514-1, 514-2, . . . and 514-Z (collectively memory modules 514). Eachmemory module 514 includes a plurality of memory integrated circuits(ICs) 520-11, 520-12, . . . , and 520-ZY (collectively memory ICs 520)and a buffer module 530-1, 530-2, . . . , and 530-Z (collectively buffermodules 530). The memory ICs 520 may be arranged on a printed circuitboard (PCB) generally identified at 531. One or more edge connectors maybe provided along one or more external edges of the PCB as shown inFIGS. 22 and 23. The memory modules 514 may have different numbers ofmemory ICs 520. A clock generator module 534 may generate a clock signalfor the memory control module 510 and the memory modules 514. The buffermodule 530 may be implemented as an integrated circuit (IC).

Communication between the memory control module 510 and the memorymodules 514 may be via serial and/or parallel signaling. A bus 531 maybe used to support data flow between the memory control module 510 andthe memory modules 514. A bus 533 may be used to support data flowbetween the memory modules 514 and the memory control module 510.Differential signaling may be used.

The system may include a variable number of channels or memory modules514. Each memory module 514 may also include a variable number of memoryICs 520. The memory ICs 520 may include dynamic random access memory(DRAM) ICs, although other types of memory may be used. The memory ICs520 and the buffer module 530 for each memory module 514 may be mountedon one or both sides of a printed circuit board (PCB) havinginterconnecting traces and/or vias. Edge connectors and/or otherconnection techniques may be used. Other packaging techniques may beused.

The buffer module 530 may buffer signals between the memory controlmodule 510, the memory modules 514, and/or signals on the buses 531 and533. The buffer modules 530 may buffer incoming control signals such asrow access and precharge (RAS), column address strobe (CAS), etc, andaddress signals. Local control/address lines (not shown) are disposed onthe memory modules 514 to locally distribute the buffered control andaddress signals to each memory IC 520 on the memory module 514. Thebuffer modules 530 may include a phase locked loop (PLL) to generatelocal phase-adjusted clock signals.

Referring now to FIG. 18, a functional block diagram of an exemplarymemory module 600 is shown. A memory control module 610 selectivelysends data storing and data retrieval commands to one of a plurality ofmemory modules 614-1, 614-2, . . . and 614-Z (collectively memorymodules 614). Each memory module 614 includes a plurality of memoryintegrated circuits (ICs) 620-11, 620-12, . . . , and 620-ZY(collectively memory ICs 620) and a buffer and error correction modules630-1, 630-2, . . . and 630-Z (collectively buffer and error correctionmodules 630). A clock generator module 634 may generate a clock signalfor the memory control module 610 and the memory modules 614. The bufferand error correction modules 630 may be integrated circuits.

The buffer and error correction module 630 includes random access memory(RAM) 640-1, 640-2, . . . and 640-Z (collectively RAM 640), contentaddressable memory (CAM) 642-1, 642-2, . . . and 642-Z (collectively CAM642) and non-volatile (NV) memory 644-1, 644-2, . . . and 644-Z(collectively NV memory 644). The RAM 640 and NV memory 644 and/oradditional RAM and/or NV memory may be provided to support bufferfunctions described above. The CAM 642 may be used for making randomrepairs such as to random data portions as described above and below.The RAM 640 may be used to temporarily store data blocks or pages duringtesting of the pages. As a result, data storage and retrieval of thedata will not be interrupted during testing of the memory. The NV memory644 may be used to store addresses of defective locations and/or otherinformation as will be described below.

After testing the page, errors may be detected and corrected using ECCand/or CAM. The CAM 642 may be used to make random repairs in the memory806 since it may be too costly to use CAM for temporarily storing entirepages. In other words, the repairs made by the CAM 642 may be smallerthan a page. The RAM 640 is used to temporarily store one or more pagesduring testing of the pages. The NV memory 644, which may include flashor other suitable NV semiconductor memory, stores a look-up table (LUT)associating the address(es) of the page under test with the temporaryaddress(es) of the page in the RAM 640.

The memory ICs 620 and/or the RAM 640 may include any type of memory.For example, the memory ICs 620 and/or the RAM 640 may include staticrandom access memory (SRAM), dynamic random access memory (DRAM), flash,non-volatile memory, phase change memory, multi-bit memory and/or anyother suitable type of memory.

Referring now to FIG. 19, a flowchart illustrating steps performed bythe memory module 614 of FIG. 18 is shown. Control begins in step 700.In step 704, the page under test is mapped to the RAM 640 and NV memory644. In other words, the page address of the page under test is storedin NV memory 644 and the data in the page is stored in the RAM 640. Instep 708, refresh to the page is suspended and the page is tested. Anysuitable testing may be performed.

For example, test values may be written into some or all of the cells inthe page. Then, the values in the cells can be read back after apredetermined period. The predetermined period may be longer than thenormal refresh period. If the memory cells do not maintain the chargesufficiently for the predetermined period, the cell may be deemedfaulty. Still other types of testing may be performed.

After the test is complete, the data can be returned to the memory cellsin the page if the memory cells passed the test and the page address canbe removed from the NV memory 644. In step 718, control determineswhether random bit faults were detected. If true, the address of thememory cell and/or data associated with the faulty memory cell may bestored in the CAM 642 in step 720. Subsequent memory storage andretrieval requests to the faulty memory cells are redirected to the CAM642. In step 726, control determines whether there are other pages totest. If true, control returns to step 704. Otherwise control ends instep 728.

In some implementations, the memory module 600 may be a dual in-linememory module (DIMM), a fully buffered DIMM (FB DIMM), a single in-linememory module (SIMM) and/or any other type of memory module.

Referring now to FIG. 20, operation of an exemplary memory system suchas memory module 614 during a read operation is shown. The memory module614 includes CAM 814 that stores random data errors and random accessmemory (RAM) and non-volatile (NV) memory 808 that store pages duringtesting of the pages in memory 806 of the memory module 614.

The memory control module 802, the control module 807 and/or any otherdevice may identify one or more pages under test in memory 806. Thememory 806 may include the memory ICs 620 for the memory module 614. Thememory control module 802 and/or the control module 807 may include atest module 803 that tests the memory after manufacturing, duringstartup, randomly, when an event occurs and/or using any other criteria.Any other suitable testing approach for identifying faulty memory may beused.

The addresses for the one or more pages under test may be stored by acontrol module 807 in NV memory 808. In some implementations, the testmodule 803 sends address data for the pages under test to the controlmodule 807. The test module 803 may also remove the address data for thepages when the testing is complete. The control module 807 stores theaddresses for the pages under test in the NV memory 808. The NV memory808 may include flash memory and/or any other suitable NV semiconductormemory. Alternately, the test module 803 and/or any other testingcircuit may have a separate connection to the control module 807. Thetest module 803 may be integrated with the memory module 614. Thecontrol module 807 and/or memory control module 802 may trigger thememory 806 to store data in the pages under test in the memory 810. Atthe end of the test, the control module 807 and/or memory control module802 may move the data back to the memory 806. The functions of thecontrol module 807 may also be performed by the memory control module610, other control modules and/or memory controllers.

The control module 807 monitors the read address line for a match withaddresses stored in the NV memory 808. The memory 810 may be used tostore page data that would normally be sent to the page under test. Tothat end, the memory 810 selectively stores pages under test 810-1,810-2, . . . , and 810-P during testing, where P is an integer greaterthan zero. The NV memory 808 may store a lookup table associatinglogical and/or physical addresses of the page under test in the memoryICs 620 and assigned physical addresses of the page in the memory 810 tobe used during testing of the page.

When an address match occurs as determined by the control module 807,the NV memory 808 outputs the physical address of a selected page in thememory 810 to the memory 810. The memory 810 outputs the stored pagedata. Furthermore, the control module 807, NV memory 808, and/or the CAM814 may be integrated with the buffer and error correction module 630 inan integrated circuit.

The test module 803 may also identify addresses of random data that hasfailed and/or is otherwise not operational during the testing. Theaddresses of these locations may be stored in the CAM 814. The CAM 814monitors the read address line for a match. If a match occurs, the CAM814 outputs a match signal 832 and stored read data corresponding to thematched address.

The control module 807 and the CAM selectively output the match signalsto a multiplexer 816. Based on the match signal, the multiplexer 816 mayselect one of the outputs of the memory 810, the CAM 814, and the memory806. In other words, when the logical address on the address linematches an address in the CAM 814 or an address in the NV memory 808,the CAM 814 or the NV memory 808 outputs a corresponding match signal tothe multiplexer 816. The multiplexer 816 may select output of the memory806 by default. If a match signal 832 from the CAM 814 indicates amatch, the multiplexer 816 selects an output 834 of the CAM 814. If amatch signal output 820 by the control module 807 indicates a match, themultiplexer 816 selects an output 822 of the memory 810. Otherwise, themultiplexer 816 outputs the data from the memory 806 if the address(es)match address(es) associated with the memory 806. Additional memorymodules 614 may be connected to the address line and data lines as shownin FIGS. 18 and 20.

Referring now to FIG. 21, operation of an exemplary memory module 614during a write operation is shown. The control module 807 monitors thewrite address line for a match with addresses stored in the NV memory808. When a match occurs as determined by the control module 807, thecontrol module 807 sends a match signal 840 to a multiplexer 844. The NVmemory 808 outputs the physical address of a selected page in the memory810 to the memory 810. The memory 810 writes the stored information tothe identified address.

The CAM 814 also compares the write address to stored addresses andselectively sends a match signal 846 when a match occurs. If a matchoccurs, the CAM 814 writes the data on the write data bus to a locationin the CAM 814 corresponding to the matched address.

The control module 807 and the CAM 814 selectively output match signalsto a multiplexer 844. Based on the match signals, the multiplexer 844outputs the write data to one of the memory 810, the CAM 814, and thememory 806. Otherwise, the multiplexer 816 outputs the write data fromthe write address bus to the memory 806 if the address(es) matchaddress(es) associated with the memory 806. Additional memory modules614 may be connected to the write address bus and write data bus asshown in FIGS. 18 and 21.

Referring now to FIGS. 22-23, several exemplary implementations for thememory module are shown. In FIG. 22, an edge connector 900 of a memorymodule 902 is inserted in a slot 904 of a host device 906. Components ofthe memory module 902 may be arranged on a printed circuit board (PCB)908 having the edge connector 900. The host device 906 may be anysuitable device such as a laptop, personal digital assistant, cellphone, MP3 player, computer, etc. In FIG. 22, an edge connector 910located along an edge of a PCB 918 of a memory module 912 is inserted ina slot 914 of a computer 916.

Referring now to FIG. 24, an alternate memory module 950 includes memoryintegrated circuits (ICs) 952-1, 952-2, . . . , and 952-M (collectivelymemory ICs 952). The memory module 950 may include a printed circuitboard (PCB) and/or other packaging. In addition to memory 953-1, 953-2,. . . , and 953-M (collectively memory 953), the memory ICs 952-1,952-2, . . . , and 952-M include buffer and error correction (BEC)modules 954-1, 954-2, . . . and 954-M (collectively BEC modules 954).The BEC circuits 954-1, 954-2, . . . and 954-M include RAM 956-1, 956-2,. . . and 956-M (collectively RAM 956), CAM 960-1, 960-2, . . . and960-M (collectively CAM 960) and non-volatile (NV) memory 962-1, 962-2,. . . and 962-M (collectively NV memory 962), respectively.

Instead of centralized buffer and error correction functionality asdescribed above in FIGS. 17-23, the memory module 950 has localizedbuffer and error correction functionality. Otherwise, operation of theCAM, RAM and NV memory is similar to operation described above. In someimplementations, one or more of the memory modules 950 may be controlledby the memory controller 610 and clocked by the clock generator module634 as shown in FIG. 18. The buffer 530 in FIG. 17 may also be providedin each memory module 950 to buffer control and/or data from the memorycontroller 610. In addition, the test module 803 in FIG. 20 may belocated remotely in the memory control module 610, locally in each ofthe memory ICs 952, locally in each of the BEC modules 954 and/or ineach memory module 950.

Advantages associated with the embodiments described above includeimproved memory performance particularly when testing pages. Inaddition, errors discovered during testing may be corrected.

Referring now to FIG. 25, an alternate memory module 970 includes memoryintegrated circuits (ICs) 972-1, 972-2, . . . , and 972-M (collectivelymemory ICs 972). The memory module 970 may include a printed circuitboard (PCB) and/or other packaging. In addition to memory 973-1, 973-2,. . . , and 973-M (collectively memory 973), the memory ICs 972-1,972-2, . . . , and 972-M include buffer and error correction (BEC)modules 974-1, 974-2, . . . , and 974-M (collectively BEC modules 974).The BEC circuits 974-1, 974-2, . . . and 974-M include RAM 976-1, 976-2,. . . and 976-M (collectively RAM 976), and CAM 980-1, 980-2, . . . and980-M (collectively CAM 980).

Non-volatile (NV) memory 990 communicates with the memory ICs 972 andmay be shared by the memory ICs 972. Alternately each memory IC 972 mayinclude an external NV memory IC 990 and/or other sharing arrangementscan be used. For example, H memory ICs can be associated with each NVmemory IC 990, where H is an integer greater than one and less than orequal to M. Alternately, each memory module 970 may include more thanone NV memory IC 990.

In some implementations, one or more of the memory modules 970 may becontrolled by the memory controller 610 and clocked by the clockgenerator module 634 as shown in FIG. 18. The buffer 530 in FIG. 17 mayalso be provided in each memory module 970 to buffer control and/or datafrom the memory controller 610. In addition, the test module 803 in FIG.20 may be located remotely in the memory control module 610, locally ineach of the memory ICs 972, locally in each of the BEC modules 974and/or in each memory module 970.

Referring now to FIGS. 26A and 26B, other exemplary arrangements may beused. In FIG. 26A, one or more of the memory ICs 952 from FIG. 24 may bearranged on a motherboard 992 or connected to a memory interface orother portion of a host device 993. When the motherboard 992 is used, aprocessor 994 and a memory controller 996 may also be arranged on themotherboard 992. The memory controller 996 may communicate with thememory ICs. In FIG. 26B, one or more of the memory ICs 972 from FIG. 25may be arranged on the motherboard 992 of the host device 993. Theprocessor 994 and the memory controller 996 may also be arranged on themotherboard 992.

Referring now to FIGS. 27A and 27B, systems with adaptive refresh ratesare shown. In FIG. 27A, a device 1000 includes a memory controller 1004and a memory module 1008. The memory controller 1004 may include anadaptive refresh rate module 1012 and a testing module 1016. The testingmodule 1016 and/or the adaptive refresh rate module 1012 may beassociated with the memory controller 1004 as shown, with the memorymodule 1008 as shown in FIG. 27B and/or as stand-alone devices. Thememory module 1008 includes memory 1020 and a BEC module 1024. The BECmodule 1024 includes RAM 1028, CAM 1032 and NV memory 1036. As shownabove, the NV memory may be integrated with or external from the BECmodule 1024. To or more of the memory 1020, the RAM 1024, CAM 1032, NVmemory 1036, adaptive refresh module 1012 and/or the testing module 1016may be integrated as a system on chip.

Referring now to FIG. 28, exemplary steps performed by the adaptiverefresh rate module begin in step 1050. In step 1054, testing isperformed to determine whether the memory cells can operate with thecurrent refresh rate. If the memory cells are unable to maintain thecorrect state for the duration of the current refresh time period, theywill fail during the testing. In step 1058, control determines whethersome of the memory cells failed during testing at the current refreshrate. If step 1058 is false, control returns to step 1054. If step 1058is true, the adaptive refresh rate module 1012 decreases the time periodbetween refresh for all of the memory cells in the memory module in step1062. In other words, the adaptive refresh rate module 1012 refreshesthe memory cells faster to prevent failure of the memory cells. This, inturn, tends to increase power dissipation of the memory module and/orthe host device associated therewith. This also tends to reduceavailability of the memory cells, which tends to reduce performance.

Referring now to FIG. 29, steps performed by the adaptive refresh ratemodule begin in step 1100. In step 1104, the memory cells are tested ata current refresh rate. In step 1108, control determines whether thesome of the memory cells fail during the test. If step 1108 is false,control returns to step 1104. If step 1108 is true, control determineswhether the number of failing memory cells are less than or equal to theavailable number of CAM memory cells in step 1112. If step 1112 is true,control uses the CAM cells to replace failing memory cells in step 1118and maintains the current refresh rate. If step 1112 is false and thereare not enough available CAM cells, control reduces the time betweenrefresh for all of the memory cells in step 1120.

Referring now to FIG. 30, alternate steps performed by the adaptiverefresh rate module are shown. Control begins in step 1150. In step1154, control determines the minimum time period between refresh thatwill produce no failing memory cells. In step 1158, control determinesthe number of available CAM memory cells. In step 1162, controloptimizes a relationship between the number of CAM memory cells that areused for failing memory cells and the refresh rate. This step may alsobalance the number of faulty memory cells that are faulty for reasonsother than the refresh rate as described above. In step 1168, controluses the CAM memory cells to replace faulty memory cells with refreshrate problems that are identified in step 1154.

Referring now to FIG. 31, control begins with step 1200. In step 1208,control sets the refresh rate to an initial value. In step 1212, controlperforms testing to determine whether the memory cells fail the test atan initial time period between refresh. If step 1212 is true, controldetermines whether the number of faulty memory cells (due to the currentrefresh rate) are less than a first threshold CAM_(TH1). The firstthreshold CAM_(TH1) may be an integer that is greater than one and lessthan the number of CAM memory cells. If step 1214 is false, controldetermines whether the number of faulty memory cells with the refreshrate problem are less than or equal to a second threshold CAM_(TH2). Thesecond threshold may be an integer that is greater than the firstthreshold CAM_(TH1) and less than the number of CAM memory cells.

If step 1218 is false, control increases the refresh rate in step 1220and returns to step 1212. If step 1212 is false, control decreases therefresh rate in step 1224 and control returns to step 1212. If step 1214is true, control uses CAM memory cells to replace faulty memory cellswith refresh rate problems, increases the time period between refresh bya predetermined amount in step 1228 and control returns to step 1212. Ifstep 1218 is true, control uses the CAM memory cells to replace faultymemory cells with refresh rate problems and maintains the currentrefresh rate in step 1234. Control continues from step 1234 to step1212.

The approaches described above identify an optimal time period betweenrefresh using the CAM memory cells. As a result, power dissipation canbe optimized during the life of the device. This improvement can beimportant for mobile devices that rely on battery power.

Referring now to FIGS. 32A-32G, various exemplary implementationsincorporating the teachings of the present disclosure are shown.

Referring now to FIG. 32A, the teachings of the disclosure can beimplemented in memory of a hard disk drive (HDD) 1300. The HDD 1300includes a hard disk assembly (HDA) 1301 and a HDD PCB 1302. The HDA1301 may include a magnetic medium 1303, such as one or more plattersthat store data, and a read/write device 1304. The read/write device1304 may be arranged on an actuator arm 1305 and may read and write dataon the magnetic medium 1303. Additionally, the HDA 1301 includes aspindle motor 1306 that rotates the magnetic medium 1303 and avoice-coil motor (VCM) 1307 that actuates the actuator arm 1305. Apreamplifier device 1308 amplifies signals generated by the read/writedevice 1304 during read operations and provides signals to theread/write device 1304 during write operations.

The HDD PCB 1302 includes a read/write channel module (hereinafter,“read channel”) 1309, a hard disk controller (HDC) module 1310, a buffer1311, nonvolatile memory 1312, a processor 1313, and a spindle/VCMdriver module 1314. The read channel 1309 processes data received fromand transmitted to the preamplifier device 1308. The HDC module 1310controls components of the HDA 1301 and communicates with an externaldevice (not shown) via an I/O interface 1315. The external device mayinclude a computer, a multimedia device, a mobile computing device, etc.The I/O interface 1315 may include wireline and/or wirelesscommunication links.

The HDC module 1310 may receive data from the HDA 1301, the read channel1309, the buffer 1311, nonvolatile memory 1312, the processor 1313, thespindle/VCM driver module 1314, and/or the I/O interface 1315. Theprocessor 1313 may process the data, including encoding, decoding,filtering, and/or formatting. The processed data may be output to theHDA 1301, the read channel 1309, the buffer 1311, nonvolatile memory1312, the processor 1313, the spindle/VCM driver module 1314, and/or theI/O interface 1315.

The HDC module 1310 may use the buffer 1311 and/or nonvolatile memory1312 to store data related to the control and operation of the HDD 1300.The buffer 1311 may include DRAM, SDRAM, etc. The nonvolatile memory1312 may include flash memory (including NAND and NOR flash memory),phase change memory, magnetic RAM, or multi-state memory, in which eachmemory cell has more than two states. The spindle/VCM driver module 1314controls the spindle motor 1306 and the VCM 1307. The HDD PCB 1302includes a power supply 1316 that provides power to the components ofthe HDD 1300.

Referring now to FIG. 32B, the teachings of the disclosure can beimplemented in a memory of a DVD drive 1318 or of a CD drive (notshown). The DVD drive 1318 includes a DVD PCB 1319 and a DVD assembly(DVDA) 1320. The DVD PCB 1319 includes a DVD control module 1321, abuffer 1322, nonvolatile memory 1323, a processor 1324, a spindle/FM(feed motor) driver module 1325, an analog front-end module 1326, awrite strategy module 1327, and a DSP module 1328.

The DVD control module 1321 controls components of the DVDA 1320 andcommunicates with an external device (not shown) via an I/O interface1329. The external device may include a computer, a multimedia device, amobile computing device, etc. The I/O interface 1329 may includewireline and/or wireless communication links.

The DVD control module 1321 may receive data from the buffer 1322,nonvolatile memory 1323, the processor 1324, the spindle/FM drivermodule 1325, the analog front-end module 1326, the write strategy module1327, the DSP module 1328, and/or the I/O interface 1329. The processor1324 may process the data, including encoding, decoding, filtering,and/or formatting. The DSP module 1328 performs signal processing, suchas video and/or audio coding/decoding. The processed data may be outputto the buffer 1322, nonvolatile memory 1323, the processor 1324, thespindle/FM driver module 1325, the analog front-end module 1326, thewrite strategy module 1327, the DSP module 1328, and/or the I/Ointerface 1329.

The DVD control module 1321 may use the buffer 1322 and/or nonvolatilememory 1323 to store data related to the control and operation of theDVD drive 1318. The buffer 1322 may include DRAM, SDRAM, etc. Thenonvolatile memory 1323 may include flash memory (including NAND and NORflash memory), phase change memory, magnetic RAM, or multi-state memory,in which each memory cell has more than two states. The DVD PCB 1319includes a power supply 1330 that provides power to the components ofthe DVD drive 1318.

The DVDA 1320 may include a preamplifier device 1331, a laser driver1332, and an optical device 1333, which may be an optical read/write(ORW) device or an optical read-only (OR) device. A spindle motor 1334rotates an optical storage medium 1335, and a feed motor 1336 actuatesthe optical device 1333 relative to the optical storage medium 1335.

When reading data from the optical storage medium 1335, the laser driverprovides a read power to the optical device 1333. The optical device1333 detects data from the optical storage medium 1335, and transmitsthe data to the preamplifier device 1331. The analog front-end module1326 receives data from the preamplifier device 1331 and performs suchfunctions as filtering and A/D conversion. To write to the opticalstorage medium 1335, the write strategy module 1327 transmits powerlevel and timing information to the laser driver 1332. The laser driver1332 controls the optical device 1333 to write data to the opticalstorage medium 1335.

Referring now to FIG. 32C, the teachings of the disclosure can beimplemented in a memory of a high definition television (HDTV) 1337. TheHDTV 1337 includes a HDTV control module 1338, a display 1339, a powersupply 1340, memory 1341, a storage device 1342, a WLAN interface 1343and associated antenna 1344, and an external interface 1345.

The HDTV 1337 can receive input signals from the WLAN interface 1343and/or the external interface 1345, which sends and receives informationvia cable, broadband Internet, and/or satellite. The HDTV control module1338 may process the input signals, including encoding, decoding,filtering, and/or formatting, and generate output signals. The outputsignals may be communicated to one or more of the display 1339, memory1341, the storage device 1342, the WLAN interface 1343, and the externalinterface 1345.

Memory 1341 may include random access memory (RAM) and/or nonvolatilememory such as flash memory, phase change memory, or multi-state memory,in which each memory cell has more than two states. The storage device1342 may include an optical storage drive, such as a DVD drive, and/or ahard disk drive (HDD). The HDTV control module 1338 communicatesexternally via the WLAN interface 1343 and/or the external interface1345. The power supply 1340 provides power to the components of the HDTV1337.

Referring now to FIG. 32D, the teachings of the disclosure may beimplemented in a memory of a vehicle 1346. The vehicle 1346 may includea vehicle control system 1347, a power supply 1348, memory 1349, astorage device 1350, and a WLAN interface 1352 and associated antenna1353. The vehicle control system 1347 may be a powertrain controlsystem, a body control system, an entertainment control system, ananti-lock braking system (ABS), a navigation system, a telematicssystem, a lane departure system, an adaptive cruise control system, etc.

The vehicle control system 1347 may communicate with one or more sensors1354 and generate one or more output signals 1356. The sensors 1354 mayinclude temperature sensors, acceleration sensors, pressure sensors,rotational sensors, airflow sensors, etc. The output signals 1356 maycontrol engine operating parameters, transmission operating parameters,suspension parameters, etc.

The power supply 1348 provides power to the components of the vehicle1346. The vehicle control system 1347 may store data in memory 1349and/or the storage device 1350. Memory 1349 may include random accessmemory (RAM) and/or nonvolatile memory such as flash memory, phasechange memory, or multi-state memory, in which each memory cell has morethan two states. The storage device 1350 may include an optical storagedrive, such as a DVD drive, and/or a hard disk drive (HDD). The vehiclecontrol system 1347 may communicate externally using the WLAN interface1352.

Referring now to FIG. 32E, the teachings of the disclosure can beimplemented in a memory of a cellular phone 1358. The cellular phone1358 includes a phone control module 1360, a power supply 1362, memory1364, a storage device 1366, and a cellular network interface 1367. Thecellular phone 1358 may include a WLAN interface 1368 and associatedantenna 1369, a microphone 1370, an audio output 1372 such as a speakerand/or output jack, a display 1374, and a user input device 1376 such asa keypad and/or pointing device.

The phone control module 1360 may receive input signals from thecellular network interface 1367, the WLAN interface 1368, the microphone1370, and/or the user input device 1376. The phone control module 1360may process signals, including encoding, decoding, filtering, and/orformatting, and generate output signals. The output signals may becommunicated to one or more of memory 1364, the storage device 1366, thecellular network interface 1367, the WLAN interface 1368, and the audiooutput 1372.

Memory 1364 may include random access memory (RAM) and/or nonvolatilememory such as flash memory, phase change memory, or multi-state memory,in which each memory cell has more than two states. The storage device1366 may include an optical storage drive, such as a DVD drive, and/or ahard disk drive (HDD). The power supply 1362 provides power to thecomponents of the cellular phone 1358.

Referring now to FIG. 32F, the teachings of the disclosure can beimplemented in a memory of a set top box 1378. The set top box 1378includes a set top control module 1380, a display 1381, a power supply1382, memory 1383, a storage device 1384, and a WLAN interface 1385 andassociated antenna 1386.

The set top control module 1380 may receive input signals from the WLANinterface 1385 and an external interface 1387, which can send andreceive information via cable, broadband Internet, and/or satellite. Theset top control module 1380 may process signals, including encoding,decoding, filtering, and/or formatting, and generate output signals. Theoutput signals may include audio and/or video signals in standard and/orhigh definition formats. The output signals may be communicated to theWLAN interface 1385 and/or to the display 1381. The display 1381 mayinclude a television, a projector, and/or a monitor.

The power supply 1382 provides power to the components of the set topbox 1378. Memory 1383 may include random access memory (RAM) and/ornonvolatile memory such as flash memory, phase change memory, ormulti-state memory, in which each memory cell has more than two states.The storage device 1384 may include an optical storage drive, such as aDVD drive, and/or a hard disk drive (HDD).

Referring now to FIG. 32G, the teachings of the disclosure can beimplemented in a memory of a mobile device 1389. The mobile device 1389may include a mobile device control module 1390, a power supply 1391,memory 1392, a storage device 1393, a WLAN interface 1394 and associatedantenna 1395, and an external interface 1399.

The mobile device control module 1390 may receive input signals from theWLAN interface 1394 and/or the external interface 1399. The externalinterface 1399 may include USB, infrared, and/or Ethernet. The inputsignals may include compressed audio and/or video, and may be compliantwith the MP3 format. Additionally, the mobile device control module 1390may receive input from a user input 1396 such as a keypad, touchpad, orindividual buttons. The mobile device control module 1390 may processinput signals, including encoding, decoding, filtering, and/orformatting, and generate output signals.

The mobile device control module 1390 may output audio signals to anaudio output 1397 and video signals to a display 1398. The audio output1397 may include a speaker and/or an output jack. The display 1398 maypresent a graphical user interface, which may include menus, icons, etc.The power supply 1391 provides power to the components of the mobiledevice 1389. Memory 1392 may include random access memory (RAM) and/ornonvolatile memory such as flash memory, phase change memory, ormulti-state memory, in which each memory cell has more than two states.The storage device 1393 may include an optical storage drive, such as aDVD drive, and/or a hard disk drive (HDD). The mobile device may be amedia player, a personal digital assistant, a gaming console and/orother type of mobile device.

Those skilled in the art can now appreciate from the foregoingdescription that the broad teachings of the present invention can beimplemented in a variety of forms. Therefore, while this invention hasbeen described in connection with particular examples thereof, the truescope of the invention should not be so limited since othermodifications will become apparent to the skilled practitioner upon astudy of the drawings, the specification and the following claims.

1. A memory module comprising: first memory that stores data in memoryblocks; second memory that temporarily stores data from at least one ofsaid memory blocks; third memory for storing a relationship betweenaddresses of said at least one of said memory blocks in said firstmemory and corresponding addresses of said data from said at least oneof said memory blocks in said second memory, wherein storage capacitiesof said second and third memories are less than a storage capacity ofsaid first memory; and a control module that selectively transfers datain said at least one of said memory blocks in said first memory to saidsecond memory and that stores and retrieves data from said second memoryfor said at least one of said memory blocks based on said relationshipduring said testing of said at least one of said memory blocks.
 2. Thememory module of claim 1 further comprising a content addressable memory(CAM) that stores addresses of defective memory locations in said firstmemory and stores and retrieves data for said defective memorylocations.
 3. The memory module of claim 1 further comprising: a readdata bus; and a read address bus, wherein said first memory communicateswith said read data and address buses, wherein said control moduleselectively generates a first match signal when a read address on saidread address bus matches an address stored in said third memory andoutputs read data from said second memory corresponding to said address;and a multiplexer that selectively outputs said read data to said readdata bus from said second memory based on said first match signal. 4.The memory module of claim 3 further comprising a content addressablememory (CAM) that communicates with said read address and data buses andsaid multiplexer.
 5. The memory module of claim 4 wherein said CAMselectively generates a second match signal when said read address onsaid read data bus matches a stored address in said CAM and outputs dataassociated with said stored address to said multiplexer.
 6. The memorymodule of claim 5 wherein said CAM data block has a memory capacity thatis smaller than said at least one of said memory blocks.
 7. The memorymodule of claim 1 further comprising: a write data bus; and a writeaddress bus, wherein said write data and address buses communicate withsaid first memory, wherein said control module selectively generates afirst match signal when a write address on said write address busmatches an address stored in said third memory; and a multiplexer thatselectively writes data from said write address bus to said secondmemory when based on said first match signal.
 8. The memory module ofclaim 7 further comprising a content addressable memory (CAM) thatcommunicates with said write address and data buses and saidmultiplexer.
 9. The memory module of claim 8 wherein said CAMselectively generates a second match signal when a write address on saidwrite data bus matches a stored address in said CAM, writes data to saidCAM and associates said write address from said write data bus.
 10. Thememory module of claim 9 wherein said CAM has a capacity that is smallerthan said at least one of said memory blocks.
 11. A fully buffered dualin line memory module (FB DIMM) comprising the memory module of claim 1.12. The memory module of claim 1 further comprising a first buffermodule that buffers control signals.
 13. The memory module of claim 12wherein at least one of said control module, said second memory, saidthird memory and said multiplexer are integrated with said first buffermodule in an integrated circuit.
 14. The memory module of claim 12further comprising Y memory integrated circuits (ICs) that communicatewith said first buffer module, where Y is an integer greater than one.15. The memory module of claim 12 further comprising Z memory moduleseach comprising a buffer module, wherein said buffer modules of Z-1 ofsaid Z memory modules communicate with a preceding one of said Z memorymodules, and wherein said buffer module of a first one of said Z memorymodules communicates with said first buffer module, and where Z is aninteger greater than zero.
 16. The memory module of claim 1 wherein eachof said memory blocks comprises a page of data.
 17. The memory module ofclaim 1 wherein said first, second and third memories and said controlmodule are arranged on a printed circuit board.
 18. The memory module ofclaim 1 wherein said printed circuit board includes an edge connector.19. A device comprising: the memory module of claim 18; and a slot thatreceives said edge connector.
 20. The memory module of claim 1 whereinsaid control module tests said at least one memory block.
 21. A methodfor operating a memory module comprising: storing data in memory blocksof a first memory; temporarily storing data from at least one of saidmemory blocks second memory; storing a relationship between addresses ofsaid at least one of said memory blocks in said first memory andcorresponding addresses of said data from said at least one of saidmemory blocks in said second memory in a third memory, wherein storagecapacities of said second and third memories are less than a storagecapacity of said first memory; selectively transferring data in said atleast one of said memory blocks in said first memory to said secondmemory; and storing and retrieving data from said second memory for saidat least one of said memory blocks based on said relationship duringsaid testing.
 22. The method of claim 21 further comprising: storingaddresses of defective memory locations in said first memory in acontent addressable memory (CAM); and storing and retrieving data forsaid defective memory locations using said CAM.
 23. The method of claim21 further comprising: providing a read data bus and a read address bus;selectively generating a first match signal when a read address on saidread address bus matches an address stored in said third memory andoutputing read data from said second memory corresponding to saidaddress; and selectively outputting said read data to said read data busfrom said second memory based on said first match signal.
 24. The methodof claim 23 further comprising providing a content addressable memory(CAM) that communicates with said read address and data buses.
 25. Themethod of claim 24 wherein said CAM selectively generates a second matchsignal when said read address on said read data bus matches a storedaddress in said CAM and outputs data associated with said storedaddress.
 26. The method of claim 25 wherein said CAM data block has amemory capacity that is smaller than said at least one of said memoryblocks.
 27. The method of claim 21 further comprising: providing a writedata bus and a write address bus; selectively generating a first matchsignal when a write address on said write address bus matches an addressstored in said third memory; and selectively writing data from saidwrite address bus to said second memory based on said first matchsignal.
 28. The method of claim 27 further comprising providing acontent addressable memory (CAM) that communicates with said writeaddress and data buses.
 29. The method of claim 28 wherein said CAMselectively generates a second match signal when a write address on saidwrite data bus matches a stored address in said CAM, writes data to saidCAM and associates said stored address with said data.
 30. The method ofclaim 29 wherein said CAM has a capacity that is smaller than said atleast one of said memory blocks.
 31. The method of claim 21 furthercomprising providing a first buffer module that buffers control signalsreceived from a memory control module for said memory module.
 32. Themethod of claim 31 wherein at least one of said second memory and saidthird memory are integrated with said first buffer module in anintegrated circuit.
 33. The method of claim 21 wherein each of saidmemory blocks comprises a page of data.
 34. The method of claim 21further comprising arranging said first, second and third memories andsaid control module on a printed circuit board that includes an edgeconnector.
 35. The method of claim 21 wherein said control module testssaid at least one memory block.
 36. A memory system comprising thememory module of claim 2 wherein said first memory, said second memoryand said CAM are integrated by a system on chip (SOC), and furthercomprising K of said SOCs where K is an integer greater than zero andwherein said SOC and said K SOCs communicate with and share said thirdmemory.
 37. A device comprising the memory system of claim 36 andfurther comprising: a motherboard; and a memory controller, wherein saidmemory controller, said SOC and said K SOCs are arranged on saidmotherboard and communicate with said memory controller.
 38. A memorysystem comprising the memory module of claim 2 wherein said firstmemory, said second memory, said third memory and said CAM areintegrated by a system on chip (SOC), and further comprising K of saidSOCs where K is an integer greater than zero and wherein said SOC.
 39. Adevice comprising the memory system of claim 38 and further comprising:a motherboard; and a memory controller, wherein said memory controller,said SOC and said K SOCs are arranged on said motherboard andcommunicate with said memory controller.
 40. The method of claim 21further comprising: integrating said first memory, said second memoryand said CAM using a system on chip (SOC); providing K of said SOCswhere K is an integer greater than zero; and sharing said third memorybetween said SOC and said K SOCs.
 41. The method of claim 40 furthercomprising: providing a motherboard and a memory controller; andarranging said memory controller, said SOC and said K SOCs on saidmotherboard.
 42. The method of claim 21 further comprising: integratingsaid first memory, said second memory, said third memory and said CAMusing a system on chip (SOC); and providing K of said SOCs where K is aninteger greater than zero.
 43. The method of claim 42 furthercomprising: providing a motherboard and a memory controller; andarranging said memory controller, said SOC and said K SOCs on saidmotherboard.